Dispersion of nanodiamond and ultra-fine polishing of quartz wafer--颗粒学报PARTICUOLOGY

Zhu, Y., Feng, Z., Wang, B., & Xu, X. (2004). Dispersion of nanodiamond and ultra-fine polishing of quartz wafer. China Particuology, 2(4), 153-156. https://doi.org/10.1016/S1672-2515(07)60046-3

Dispersion of nanodiamond and ultra-fine polishing of quartz wafer

Yongwei Zhu ^{a b *}, Zhijing Feng ^a, Baichun Wang ^b, Xianyang Xu^{b c}

a Department of Precision Instruments and Mechanology, Tsinghua University, Beijing 100084, China
b Research and Development Center, Changsha Research Institute of Mining and Metallurgy, Changsha 410012, China
c School of Materials Science and Engineering, Central South University, Changsha 410083, China

10.1016/S1672-2515(07)60046-3

Volume 2, Issue 4, August 2004, Pages 153-156

Received 9 June 2004, Accepted 14 July 2004, Available online 27 November 2007.

E-mail: y.w.zhu@263.net

Highlights

Abstract

Mechanochemical Modification (MCM) of nanodiamond surface with DN-10 was studied in relation to the performance of nanodiamond in polishing quartz wafers. Results show that the modified nanodiamond is more stable in the pH range 8∼11. A super smooth surface with an average roughness of 0.214 nm was achieved using a nanodiamond-based slurry regulated by N-(2-hydroxyethyl)ethylenediamine. It is suggested that the principal ultra-fine polishing mechanism of quartz wafer involves atom-level removal under the synergism of chemical and mechanical actions.

Graphical abstract

Keywords

nanodiamond; dispersion; mechanochemical modification; ultra-fine polishing; quartz wafer

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