Nano-structured silver coating on copper prepared in an ethanol-based solution--颗粒学报PARTICUOLOGY

Wei, Z., Tang, D., & O'Keefe, T. (2005). Nano-structured silver coating on copper prepared in an ethanol-based solution. China Particuology, 3(5), 271-274. https://doi.org/10.1016/S1672-2515(07)60200-0

Nano-structured silver coating on copper prepared in an ethanol-based solution

Zheliang Wei ^a, Dian Tang ^a *, Thomas O'Keefe ^b

a Institute for Materials Research, Fuzhou University, Fuzhou 350002, P. R. China
b Materials Research Center, University of Missouri-Rolla, Rolla, MO 65409, USA

10.1016/S1672-2515(07)60200-0

Volume 3, Issue 5, October 2005, Pages 271-274

Received 21 February 2005, Accepted 11 July 2005, Available online 14 December 2007.

E-mail: diantang@yahoo.com

Highlights

Abstract

Recently, silver as an electrochemical deposit on copper substrate has been attracting much attention in the microelectronics field. To deposit nano-scale silver particles on copper, immersion plating using cyanide-based baths is commonly used. In this study, non-toxic ethanol was used as the plating solution. Sputtered copper samples were immersed in an ethanol-based solution containing 0.2 g·L−1 silver for silver deposition. The silver deposits were characterized by a field emission scanning electron microscope (FE-SEM), an energy dispersive X-ray spectroscope (EDS), and an atomic force microscope (AFM). It was found that the deposited particles are metallic silver. After 3 s immersion, fine particles whose diameters were around 6 nm had covered about 40% of the surface of the copper substrate. After 10 s immersion, the copper surface was completely covered by silver particles, the diameters of which have increased to about 10–15 nm. After the whole surface was covered, a dense and smooth silver coating was obtained.

Graphical abstract

Keywords

Ag; Cu; nano-particle; ethanol

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