Electroless copper plating using dimethylamine borane as reductant--颗粒学报PARTICUOLOGY

Liao, Y., Zhang, S., & Dryfe, R. (2012). Electroless copper plating using dimethylamine borane as reductant. Particuology, 10(4), 487–491. https://doi.org/10.1016/j.partic.2011.09.009

Electroless copper plating using dimethylamine borane as reductant

Yong Liao ^{a b *}, Shengtao Zhang ^a, Robert Dryfe ^b

a College of Chemistry & Chemical Engineering, University of Chongqing, Chongqing 400044, China
b School of Chemistry, The University of Manchester, Manchester M13 9PL, UK

10.1016/j.partic.2011.09.009

Volume 10, Issue 4, August 2012, Pages 487-491

Received 24 February 2011, Accepted 16 September 2011, Available online 8 March 2012.

E-mail: liaoyong@cqu.edu.cn

Highlights

► The high pH values (10–12.5) promote the oxidation of DMAB, and suppress the reduction of the copper ion.

► Results for a dual-chelating agent system indicate that 1,5,8,12-tetraazadodecane plays an important role in chelation.

► The main effect of TEA is adsorption on copper surfaces to inhibit DMAB oxidation and to promote deposition.

Abstract

Electroless copper plating was studied using dimethylamine borane (DMAB) as reductant and 1,5,8,12-tetraazadodecane as additive and triethanolamine (TEA) as buffer. The effects of pH, temperature and concentrations of reactants and additives on the anodic oxidation of DMAB and the cathodic reduction of copper ion were investigated. Experimental results indicate that high pH values (10–12.5) promote the oxidation of DMAB, and suppress the reduction of the copper ion, while high bath temperatures (55–70 °C) accelerate both anodic oxidation and cathodic reduction. Increase of the Cu²⁺ and DMAB concentrations can improve the deposition rate of copper plating. Results for a dual-chelating-agent system indicate that 1,5,8,12-tetraazadodecane plays an important role in chelation, while the main effect of TEA is adsorption on copper surfaces to inhibit DMAB oxidation and to promote deposition.

Graphical abstract

Keywords

Electroless copper plating; DMAB; Polarization; Anodic oxidation; Cathodic reduction

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