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Volume 111
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Experimental study of a hybrid pin fin heat sink using phase change material and graphene nanofluid for electronic cooling
Mani Ravichander Srevathsan, Chandrasekaran Selvam *, Ramalingam Senthil *
Department of Mechanical Engineering, SRM Institute of Science and Technology, Kattankulathur, Chennai, 603203, Tamil Nadu, India
10.1016/j.partic.2026.02.006
Volume 111, April 2026, Pages 150-163
Received 10 October 2025, Revised 2 February 2026, Accepted 3 February 2026, Available online 12 February 2026, Version of Record 19 February 2026.
E-mail: selvamc@srmist.edu.in; senthilr@srmist.edu.in
Highlights

• Hybrid heat sinks with fins, phase change material, and nanofluids are studied.

• Surface temperature of the hybrid heat sink reduced from 76 °C to 33 °C.

• Heat transfer coefficient of nanofluids enhanced by 35.5% with 0.1 vol% of GnP.

• The thermal resistance of the heat sink was reduced by 72.5% with 0.1 vol% of GnP.

• Hybrid heat sinks with heat storage and nanofluid boosts heat transfer performance.


Abstract

Efficient thermal management is essential for high-performance electronics, requiring reliable systems to improve heat dissipation and extend device lifespan. This study experimentally examines the cooling performance of a square-shaped hybrid heat sink combining helix and circular pin fin structures with a paraffin-based phase change material (PCM). A baseline test was conducted with a standalone helix heat sink using distilled water and graphene nanoplatelet (GnP)-based nanofluids (0.01–0.1 vol%) at power inputs of 60–100 W and flow rates of 0.6–2.2 mL/s. At 2.2 mL/s with 0.1% GnP, the lowest thermal resistance and the most significant temperature reduction were achieved, due to improved convective heat transfer. Then, a hybrid heat sink with PCM was tested under identical conditions, resulting in surface temperature reductions of up to 45 °C at 60 W and 76 °C at 100 W compared to the base case. The average surface-temperature increase per 100 s was lowest for the pin-fin heat sink with PCM (0–3 °C) and highest for configurations without PCM (up to 5 °C). A 35.5% increase in convective heat transfer coefficient (CHTC) was observed at 100 W, along with a 72.5% reduction in thermal resistance at 80 W, both at a flow rate of 2.2 mL/s with 0.1% GnP. At a Reynolds number of 1050, the hybrid heat sink achieved a maximum CHTC of 1142.86 W/(m2 K), about 12% higher than the helix-only design. Across all input power levels, the hybrid system consistently exhibited lower thermal resistance and higher CHTC, demonstrating a significant improvement in heat dissipation and providing a durable, efficient cooling solution for high-power electronic devices.

Graphical abstract
Keywords
Hybrid heat sink; Phase change material; Nanofluids; Heat transfer coefficient; Thermal resistance
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