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Volume 113
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Interface design and reinforcement mechanisms in carbon nanotube reinforced copper matrix composites for mechanical, electrical and thermal conductivity properties: A review
Fanfan Zhou, Xiaohong Chen *, Honglei Zhou, Ping Liu
School of Materials and Chemistry, University of Shanghai for Science and Technology, Shanghai, 200093, China
10.1016/j.partic.2026.03.016
Volume 113, June 2026, Pages 63-87
Received 28 January 2026, Revised 1 March 2026, Accepted 15 March 2026, Available online 25 March 2026, Version of Record 31 March 2026.
E-mail: cxh10761112@163.com
Highlights

• Summarizes CNTs dispersion strategies and evaluates their effectiveness.

• Analyzes CNTs/Cu interface designs and explains their effects on bonding strength.

• Outlines multiscale reinforcement mechanisms and clarifies CNTs reinforcing roles.

• Highlights future directions and challenges for high performance Cu composites.


Abstract

Recently, carbon nanotubes (CNTs)-reinforced copper (Cu) matrix (CNTs/Cu) composites have attracted significant research interest due to their excellent properties and potential applications. These studies focus on interfacial design and reinforcement mechanisms, as interface bonding is crucial for composite performance. However, CNTs tend to agglomerate and have poor wettability with Cu, leading to weak mechanical bonding at the interface. This weak bonding limits load transfer and electron conduction, reducing the performance of composites. To achieve high-performance CNTs/Cu composites, it is crucial to design the interface structure and consider its impact on composite properties. This paper reviews recent progress on CNTs dispersion methods and interface design in CNTs/Cu composites, with a focus on interface bonding mechanisms and their effect on performance. First, it introduces CNTs dispersion techniques and their impact on interface design. Then, it explores different interface modification strategies and their influence on interface strength and overall performance. Additionally, the paper reviews how interface design affects the mechanical, electrical and thermal properties of composites and four reinforcement mechanisms that enhance performance. Finally, the paper summarizes current technical challenges and future research directions, providing insights into interface design for CNTs/Cu composites and useful references for interface engineering of CNTs with other metals.

Graphical abstract
Keywords
CNTs/Cu composites; Dispersion methods; Interface design; Reinforcement mechanisms
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